purpose
1, suitable for desoldering and soldering BGA, SOIC, CHIP, QFP, PLCC and other packaged chip, especially suitable for BGA module, computer main board, north and south bridge, mobile phone main board all kinds of chip LED lamp desoldering.
2. Used for heat shrinkage, drying, paint removal, stickiness removal, thawing, preheating, glue welding, etc.
machine parameters
| Model | DHS-853AAA |
| Size | 320 (L) * 220 (W) * 270 (H) mm ± 5mm |
| Weight | Approx. 5.6kg |
preheating table
| Temperature control range | 50-400 ℃ |
| Temperature stability | ± 2 ℃ (static) |
| Display mode | LED digital display |
| Heating area area | 120 * 120mm |
Heat gun
| Air supply mode | Brushless motor Fan |
| Airflow | ≤ 120L/min (max.) |
| Temperature control range | 100 ° C~ 480 * C |
| Temperature stability | ± 1 ° C (static) |
| Display mode | LED digital display |
soldering iron
| Temperature control range | 200 ° C~ 480 * C |
| Temperature stability | ± 1 ° C (static) |
| display mode | LED digital display |
